Chemical intermediates for Cu plating

DPS(N,N-dimethyl-dithiocarbamylpropyl sulfonic acid, sodium salt)(CAS.:18880-36-9)

EDTP(Q75)N,N,N'N'-tetra(2-hydropropyl)ethylene diamine(0-0-0)

H1(2-mercapto thiazoline)(CAS.:96-53-7)

JPH(Aqueous cross-linking polyamide)(0-0-0)

MPS(3-mercapto-1-propysulfonate, sodium salt)(CAS.:17636-10-1)

N(ethenethiourea)(CAS.:96-45-7)

SPS(Bis-(sodium sulfopropyl) disulfide)(CAS.:27206-35-5)

ZPS(3-(benzothiazolyl-2-mercapto)-propylsulfonate ,sodium salt)(CAS.:49625-94-7)

M(2-mercaptobenzimidazole)(CAS.:583-39-1)(CAS.:583-39-1)